发明名称 HEAT-RESISTANT RESIN COMPOSITION
摘要 A resin composition comprising (A) at least one heat-resistant resin, (B) at least one thermoplastic resin, (C) an antimony oxide, (D) at least one brominecontaining reaction product selected from the group consisting of (1) a compound having a molecular weight of from 1,200 to 6,000 and a bromine content of from 5.0 to 60% by weight which is obtained by reacting a bromine-containing epoxy compound and 1,3,5tribromophenol, and (2) a compound obtained by reacting a bromine-containing epoxy compound having an epoxy equivalent of from 450 to 7,000 and a bromine content of from 5.0 to 52% by weight and an acrylonitrile-butadiene copolymer having a carboxyl group at the both terminals thereof and a molecular weight of from 1,000 to 10,000, and (E) at least one silicon-containing compound selected from the group consisting of (1) silicone oil, (2) a ladder silicone resin, and (3) an alkoxysilane having a mercapto group, a vinyl group or a methacryloyl group, is disclosed. The resin composition is excellent in heat resistance, impact resistance, flame retardancy, and molding properties.
申请公布号 CA1327414(C) 申请公布日期 1994.03.01
申请号 CA19890603622 申请日期 1989.06.22
申请人 SHOWA DENKO KABUSHIKI KAISHA 发明人 WASHIYAMA, JUNICHIRO;AOYAMA, CHIKARA;YASUDA, TETSUO
分类号 C08G59/14;C08G59/30;C08K3/22;C08K5/54;C08L25/08;C08L51/04;C08L63/00;(IPC1-7):C08L51/04;C08L83/04 主分类号 C08G59/14
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