摘要 |
<p>A process for producing a polyimide film is provided to reduce variations in adhesion of polyimide films, and to obtain polyimide films having improved adhesion in a stable manner. A process for producing a polyimide film comprises applying, onto the single surface or both surfaces of a self-supporting film of a polyimide precursor solution, a solution containing a polyamic acid oligomer having an alkoxysilyl group with the following characteristic (i) and/or (ii) on at least one end, followed by heating and imidization: (i) the polyamic acid oligomer is obtained by reacting tetracarboxylic acid dianhydride, diamine, alkoxysilane compound having a primary amino group at one end thereof, and optionally a monoamine end-capping agent, in a molar ratio of XA : XB : XC = 2 : n : (n-1), and XD : XE1 = 2 : 0-1 : 1 (wherein XA is the combined moles of the alkoxysilane compound and end-capping agent, I.e., XD+XE1; XB is the moles of the tetracarboxylic acid dianhydride; XC is the moles of the diamine; XD is the moles of the alkoxysilane compound; XE1 is the moles of the monoamine end-capping agent; and n is an integer of 1-5); and (2) the polyamic acid oligomer is obtained by reacting tetracarboxylic acid dianhydride, diamine, alkoxysilane compound having a carboxylic anhydride group at one end thereof, and optionally a carboxylic anhydride end-capping agent, in a molar ratio of XA : XB : XC = 2 : n : (n-1), and XD : XE2 = 2 : 0-1 : 1 (wherein XA is the combined moles of the alkoxysilane compound and end-capping agent, I.e., XD+XE2; XB is the moles of the tetracarboxylic acid dianhydride; XC is the moles of the diamine; XD is the moles of the alkoxysilane compound; XE2 is the moles of the carboxylic anhydride end-capping agent; and n is an integer of 1-5).</p> |