| 摘要 |
A memory module dynamic burn-in device using a mother board is provided to enhance efficiency related to a burn-in test of a memory module by applying simultaneously burn-in test signals to a plurality of burin-in boards. A mother board(100) is used for supplying power, amplifying a plurality of memory test signals step by step, and transmitting the amplified memory test signals in a high speed state through a high speed cable(170). A plurality of burn-in boards(200) includes a plurality of module sockets. The module sockets are connected in parallel to each other. A plurality of memory modules are mounted on the module sockets. The burn-in boards are operated by receiving the power from the mother board, in order to receive memory test signals and to apply the memory test signals to the memory modules. |
