PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND ELECTRONIC DEVICE

摘要

An opening for connection is formed without roughening the surface of a base film. A printed wiring board is formed by arranging a protective film (c) on a base film (b) having a wiring pattern formed of a conductor foil (e), and then thermally compression bonding the films by a heating/pressing means. The base film (b) and the protective film (c) are made of a polyimide, and the protective film (c) and an adhesive layer (a) are provided with first openings (h1, h2, h3) for exposing the base film (b) and second openings (k4, k5, k6) for exposing only the conductor foil (e).