发明名称 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device in which the magnitude of ON current is assured, while assuring a high breakdown voltage at the junction of a first conductivity-type well region and a second conductivity type softening electric field region without increasing the chip size, and to provide its fabrication method. SOLUTION: An opposite conductivity-type region is provided in a lightly-doped region for softening the electric field. As a result concentration of the electric field in the vicinity of a trench corner is thereby relaxed, and the breakdown voltage can be improved. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008198631(A) 申请公布日期 2008.08.28
申请号 JP20070029007 申请日期 2007.02.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OHARA KANJI
分类号 H01L29/78;H01L29/41;H01L29/423;H01L29/49 主分类号 H01L29/78
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