发明名称 METHODS AND APPARATUS TO IMPROVE FRIT-SEALED GLASS PACKAGE
摘要 <p>A hermetically sealed package includes: a first plate (102) including inside and outside surfaces; a second plate (104) including inside and outside surfaces; frit material (106) disposed on the inside surface of the second plate; and at least one dielectric layer (108) disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the frit material forms a hermetic seal against the dielectric layer in response to heating.</p>
申请公布号 WO2008103338(A1) 申请公布日期 2008.08.28
申请号 WO2008US02159 申请日期 2008.02.19
申请人 CORNING INCORPORATED;CHATTERJEE, DILIP, K.;NGUYEN, KELVIN 发明人 CHATTERJEE, DILIP, K.;NGUYEN, KELVIN
分类号 H01L51/52 主分类号 H01L51/52
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