| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of jointing of a circuit component to a base substrate. SOLUTION: In a circuit component laminated body, a spacer dummy via and a substrate dummy via are arranged in a position near a spacer electrode on the side of base substrate 2 of the laminated module 3 and passed through from the opposite side of the base substrate 2 to the side of the base substrate 2 continuously. In the electrical jointing of the laminated module 3 to the base substrate 2, heat from a heat tool is conducted efficiently through the dummy via to the nearby portion of the spacer electrode on the side of the base substrate 2 of the laminated module 3. As a result, ACF on a base substrate electrode 211 can be heated efficiently, and the laminated module 3 can be jointed firmly, thus, improving the connection reliability of the laminated module 3 to the base substrate 2. The jointing of the spacer 32 to the base substrate 2, and the jointing of two or more spacers 32 and two or more circuit modules are performed in parallel, and thereby fabrication of the circuit component laminated body is simplified. COPYRIGHT: (C)2008,JPO&INPIT |
