| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible film stably which is pasted to a reinforcing plate and has a high accuracy also after a stress is released after separation, at a high reliability in connection. SOLUTION: In a method for manufacturing a circuit board, the reinforcing plate is pasted to at least one face of the flexible film through an organic layer. Next, after a circuit pattern is formed on an opposite face to a pasting face of the flexible film, the flexible film with the circuit pattern is separated from the reinforcing plate. When the coefficient of the linear expansion of the flexible film is A ppm/°C when being pasted to the reinforcing plate, a coefficient of humidity expansion of the flexible film is B ppm/% RH, the temperature of the flexible film is T°C when the flexible film is pasted to the reinforcing plate, a storage humidity of the flexible film is H% RH before the flexible film is pasted to the reinforcing plate, a storage temperature of the flexible film with the circuit pattern is T<SB>1</SB>°C after separation from the reinforcing plate, and a storage humidity obtained similarly is H<SB>1</SB>% RH; the method for manufacturing the circuit board satisfies a relationship of A×(T-T<SB>1</SB>)+B×(H-H<SB>1</SB>)>0. COPYRIGHT: (C)2007,JPO&INPIT
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