发明名称 THIN FILM DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To suppress a decrease in the withstand voltage of a capacitor in a thin film device comprising the capacitor and a increase in variation in the withstand voltage of the capacitor among products. SOLUTION: The thin film device 1 comprises a substrate 2, and the capacitor 3 provided on this substrate 2. The capacitor 3 has a lower conductor layer 10 formed on the substrate 2, a dielectric film 20 formed on the lower conductor layer 10, and an upper conductor layer 30 formed on this dielectric film 20. The thickness of the dielectric film 20 is in a range of 0.02-1μm, and is smaller than the thickness of the lower conductor layer 10. The maximum height roughness of the upper surface of the lower conductor layer 10 is not greater than a range in the thickness of the dielectric film 20. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007123690(A) 申请公布日期 2007.05.17
申请号 JP20050316293 申请日期 2005.10.31
申请人 TDK CORP 发明人 KUWAJIMA HAJIME;MIYAZAKI MASAHIRO;FURUYA AKIRA
分类号 H01G4/33;H01G4/12 主分类号 H01G4/33
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