Method of putting isolated metallic interconnections onto a metallic substrate

摘要

A method and substrate are provided for supporting one or more electronic devices including a first layer having a plurality of interconnected metallic frames laid out in a predetermined pattern. Each frame includes a frame member surrounding at least a portion of each frame, one or more metal pads and a plurality of metal tabs. Each tab connects to at least one of a metal pad and the frame member. A second generally planar nonconductive layer is secured to and covering at least a portion of a first surface of one or more metal pads. The nonconductive layer insulates the covered portion of the first surface of the at least one metal pad. A third generally planar layer that has a plurality of conductive traces is provided. Each trace has a first surface that is secured to and covers at least a portion of the nonconductive layer and a second surface that receives and supports an electronic device.