| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain substantial high-density packaging and batch packaging, to obtain excellent heat discharge, and to reduce manufacturing costs in a light emitting element; and to provide its manufacturing method. <P>SOLUTION: The light emitting element 1 is provided with a transparent crystal substrate 6, one semiconductor layer 2 out of semiconductor layers consisting of p-type and n-type nitride semiconductor layers, the other semiconductor layer 3 in the nitride semiconductor layers, semiconductor surface electrodes 21, 31 for injecting currents to respective semiconductor layers 2, 3, an insulating substrate 4, and a packaging surface electrode 5 for packaging. These elements are successively laminated. The semiconductor layer 2 has a non-laminated layer 20 on which the semiconductor layer 3 is not partially laminated, and the semiconductor surface electrode 21 formed on the surface of the non-laminated layer 20 and the semiconductor surface electrode 31 formed on the semiconductor layer 3 are opposed to the insulating substrate 4. A through electrode 10 is formed on the insulating substrate 4, and the semiconductor surface electrodes 21, 31 are electrically connected to the packaging surface electrode 5 by the through electrode 10. The insulating substrate 4 becomes a substrate for protecting the semiconductor layers 2, 3 and forming the packaging surface electrode 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
