| 摘要 |
A piezoelectric/electrostrictive device is provided, including a substrate, an electrode layer adhering to the surface of the substrate, and a piezoelectric/electrostrictive layer adhering to the electrode layer. The electrode layer is deformed by high-temperature creep. A method for manufacturing the piezoelectric/electrostrictive device is provided including a step of cooling the piezoelectric/electrostrictive device, after firing, at a temperature decreasing rate of at least the rate of natural cooling. The cooling step includes a sub-step of holding the piezoelectric/electrostrictive device at a constant holding temperature that is lower than the firing temperature. The holding temperature is within a range of temperatures at which high-temperature creep occurs in the metal of the electrode layer so that residual stress in the piezoelectric/electrostrictive layer can be reduced.
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