| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a TAB tape of which the problem of occurrence of plating failure with a TAB tape is solved for improved reliability. SOLUTION: The manufacturing method of a TAB tape includes a process in which a copper foil 10 arranged on an oblong insulating substrate 1 for a TAB tape that is set to mount a plurality of semiconductor devices is pattern-processed in a patterning process including an etching process, and then a wiring pattern 2 connected to the semiconductor device, a feeding band-like pattern 3 extending in the length direction of the insulating substrate 1, and a feeding lead 4 that connects between the feeding band-like pattern 3 and the wiring pattern 2 are formed. It also includes a process in which an electrolytic plating is applied on the surface of the wiring pattern 2 while a specified current is supplied to the wiring pattern 2 through the feeding band-like pattern 3 and the feeding lead 4. The line thickness of the feeding lead 4 is set thicker than that of the wiring pattern 2. COPYRIGHT: (C)2008,JPO&INPIT
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