发明名称 MOLD AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mold which can simply be manufactured and is lightweight and inexpensive. SOLUTION: The mold 10 has a base part 14 with a plurality of corrugated and laminated cardboard sheets 12 and a molding surface 16 which is formed in the base part 14 and swelled in accordance with the surface shape of a molding. The corrugated cardboard sheets 12 are laminated to make the steps 24 of cores 22 extend in the same direction, and the molding surface 16 is recessed in the extension direction of the steps 24. A resin layer 30 is formed on the molding surface 16. A hole 32 communicating with the clearance 26 between the steps 24 is formed in the resin layer 30. The hole 32 communicates with an opposite lower surface from the molding surface 16 through the clearance 26. A workpiece is molded while air is sucked through the hole 32 and the clearance 26. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008155394(A) 申请公布日期 2008.07.10
申请号 JP20060344156 申请日期 2006.12.21
申请人 HONDA MOTOR CO LTD;IWAMA KOGYOSHO:KK;EIKOH DESIGN & CREATION CO LTD;CROWN PACKAGE CO LTD 发明人 MORISHIMA TOSHIAKI;KAWASAKI TAKASHI;IWAMA MASATOSHI;MATSUMOTO YASUNARI;YAGIHARA KEIKO
分类号 B29C33/38;B29C51/10;B29C51/36 主分类号 B29C33/38
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