| 摘要 |
PROBLEM TO BE SOLVED: To provide a board transport apparatus for restricting the consumption of thermal energy, while the apparatus is reduced in size as a whole. SOLUTION: A transfer means 10 for transferring a board 6 on which an electronic part 4 is mounted with solder between through heating region 8; and a heating means 16 for carrying out the thermal fusion of the solder from the side of the board 6 in the heating region 8 are provided. The heating means 16 is constituted to be freely movable between a heating position and a non-heating position. When the board 6 is transferred to the heating region 8 by the transfer means 10, the heating means 16 is moved from the non-heating position to the heating position, and heat from the heating means 16 is transmitted to the solder from the side of the board 6. COPYRIGHT: (C)2008,JPO&INPIT |
