| 摘要 |
<p>Disclosed is a novel epoxy resin represented by the formula below, which has one or more primary hydroxy groups and one or more epoxy groups in a molecule. This epoxy resin is useful for photocuring systems. [chemical formula 1] E: epoxy resin residue c: 1, 2, 3 d: 1, 2, 3 c + d = 4</p> |
