发明名称 Polymer Compound, Photoresist Composition Including the Polymer Compound, and Resist Pattern Formation Method
摘要 The present invention provides a polymer compound which can constitute a photoresist composition which is capable of having an excellent resolution, forming a fine pattern with a good rectangularity, obtaining favorable resist characteristics even when acid strength of a acid generated from an acid generator is weak, and having favorable sensitivity; a photoresist composition including the polymer compound; and a resist pattern formation method using the photoresist composition. The photoresist composition and the resist pattern formation method use the polymer compound including an alkali soluble group (i), wherein the alkali soluble group (i) is at least one substituent group selected from an alcoholic hydroxyl group, a carboxyl group, or a phenolic hydroxyl group, and the substituent group is protected by an acid dissociable, dissolution inhibiting group (ii) represented by a general formula (1): <?in-line-formulae description="In-line Formulae" end="lead"?>-CH<SUB>2</SUB>-OCH<SUB>2</SUB><SUB>n</SUB>R<SUB>1</SUB> (1)<?in-line-formulae description="In-line Formulae" end="tail"?> (wherein R<SUB>1 </SUB>represents a cycloaliphatic group which contains no more than 20 carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom, or a halogen atom, and n represents 0 or an integer of 1 to 5.).
申请公布号 US2008166655(A1) 申请公布日期 2008.07.10
申请号 US20050589681 申请日期 2005.01.28
申请人 发明人 OGATA TOSHIYUKI;MATSUMARU SYOGO;KINOSHITA YOHEI;HADA HIDEO;SHIONO DAIJU;SHIMIZU HIROAKI;KUBOTA NAOTAKA
分类号 G03F7/004;C07C69/52;C07C69/533;C08G63/00;C08G65/34;C08G85/00;G03F7/039;G03F7/26;H01L21/027 主分类号 G03F7/004
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