| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser reflow apparatus which can solder a surface-mounting component such as BGA by radiation heat without damaging the component. <P>SOLUTION: The laser reflow apparatus 1 adopts a reflow method of emitting laser light onto the upper surface of the body M of the surface-mounting component E having a plurality of terminals formed on the undersurface of the body M to mount the surface-mounting component E on a printed board P. An emitting unit 20 has a light diffusing lens 21 that diffuses laser light from a laser light source 11. The light diffusing lens 21 expands laser light so that the ratio of the area D2 of an exposure spot I to the sectional area D1 of incident light becomes larger than 1, causing the body M to transmit radiation heat to the undersurface thereof to melt solder balls S. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
