| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method for solid state imaging device by which performance of an optical function-provided film is maintained and a solid state imaging element wafer is well bonded to a translucent substrate with high airtightness, and to provide the solid state imaging device. SOLUTION: By bonding the solid state imaging element wafer 14 after processing the optical function-provided film 12 formed on a glass wafer 11, the glass wafer 11 is well bonded to the solid state imaging element wafer 14 with high airtightness without deteriorating characteristics of the optical function-provided film 12. COPYRIGHT: (C)2008,JPO&INPIT
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