发明名称 HEAT PRESS MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat press molding apparatus which performs the transfer molding of a high accuracy. SOLUTION: This heat press molding apparatus 1 is equipped with: a fixed platen 2; and a movable platen 10 which approaches/separates from a fixed die 7 being attached to the fixed platen 2, and attaches a movable die 8 which tilts following the thickness of a molding material 29. In the heat press molding apparatus 1, an extended section 11 which moves the central point of the tilting of the movable platen 10 from the movable die 8 attached surface position of the movable platen 10 to a molding surface position of the molding material 29 or a position being separated to the vicinity, and the length of which is adjustable in response to the thickness of the movable die 8, is installed. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008265158(A) 申请公布日期 2008.11.06
申请号 JP20070111888 申请日期 2007.04.20
申请人 MEIKI CO LTD 发明人 ASAI IKUO;FUKUMOTO KENJI;NISHINO GOSHUN
分类号 B29C33/20;B29C43/04;B29C43/54;B29L11/00 主分类号 B29C33/20
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