| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a temperature adjustment unit for an electrostatic chuck electrode capable of controlling the temperature of a wafer during large-heat-input etching by application of high wafer bias electric power uniformly in a plane at a high speed over a wide temperature range. <P>SOLUTION: A refrigerant flow passage 2 provided to the electrostatic chuck electrode 1 is used as an evaporator, and the refrigerant flow passage 2, a compressor 7, a condenser 8, and a first expansion valve 9 are connected to constitute a direct expansion type refrigerating cycle. Further, a second expansion valve 10 is provided to the refrigerant flow passage between the electrostatic chuck electrode 1 and compressor 7 to adjust the flow rate of a refrigerant, and then the refrigerant can be compressed in the refrigerant flow passage 2 of the electrostatic chuck electrode 1 to control the temperature of the wafer to a high-temperature side by raising the vaporization temperature of the refrigerant. Further, the refrigerant flow passage 2 is formed in thin cylindrical structure to suppress deformation due to refrigerant pressure to fine deformation of a thin cylinder. <P>COPYRIGHT: (C)2009,JPO&INPIT |
