发明名称 |
ELASTISCHE LEITENDE VERBINDUNG FÜR ELEKTRONISCHE BAUTEILE UND VERFAHREN ZU IHRER HERSTELLUNG |
摘要 |
An interconnection element of a spring (body), and a method for fabricating the interconnection element. The interconnection element is of a size suitable for directly contacting a semiconductor or a packaged semiconductor device such as in an LGA package. The method includes fabricating a multi-tiered structure to form a compact, resilient interconnect structure. Fabricating each tier or leaf includes providing a base substrate material, and applying a masking material over the base substrate material. An opening is patterned in the masking material and a resilient element is formed in the opening. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The method includes repeating this process one or more times to fabricate a chip-level interconnection element. |
申请公布号 |
DE60040671(D1) |
申请公布日期 |
2008.12.11 |
申请号 |
DE2000640671 |
申请日期 |
2000.12.27 |
申请人 |
FORMFACTOR INC. |
发明人 |
MATHIEU, GAETAN L.;ELDRIDGE, BENJAMIN N.;GRUBE, GARY W.;LARDER, RICHARD A. |
分类号 |
H01L23/48;G01R1/067;G01R1/073;G01R3/00;H01H1/00;H01H59/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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