发明名称 Method for manufacturing a semiconductor device having an element isolation region
摘要 An n-type buried diffusion layer is formed on the surface layer of the prescribed area of a p-type silicon substrate, and a p-type first high-concentration isolation diffusion layer is formed in the silicon substrate so as to surround the buried diffusion layer. An n-type epitaxial layer is formed on the silicon substrate, the buried diffusion layer, and the first high-concentration isolation diffusion layer. A p-type second high-concentration isolation diffusion layer is formed in the epitaxial layer on the first high-concentration isolation diffusion layer. A p-type low-concentration isolation diffusion layer for isolating the epitaxial layer into a plurality of island regions is formed in the epitaxial layer on the second high-concentration isolation diffusion layer.
申请公布号 US7462530(B2) 申请公布日期 2008.12.09
申请号 US20010011774 申请日期 2001.12.11
申请人 RENESAS TECHNOLOGY CORP. 发明人 RITTAKU SATOSHI
分类号 H01L21/8238;H01L21/761;H01L21/8222;H01L21/8248;H01L21/8249;H01L27/06 主分类号 H01L21/8238
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