发明名称 Manufacturing method of semiconductor device
摘要 A semiconductor device including a drift layer of a first conductivity type formed on a surface of a semiconductor substrate. A surface of the drift layer has a second area positioned on an outer periphery of a first area. A cell portion formed in the first area includes a first base layer of a second conductivity type, a source layer and a control electrode formed in the first base layer and the source layer. The device also includes a terminating portion formed in the drift layer including a second base layer of a second conductivity type, an impurity diffused layer of a second conductivity type, and a metallic compound whose end surface on the terminating portion side is positioned on the cell portion side away from the end surface of the impurity diffused layer on the terminating portion side.
申请公布号 US7462541(B2) 申请公布日期 2008.12.09
申请号 US20050250464 申请日期 2005.10.17
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 AIDA SATOSHI;KOUZUKI SHIGEO;IZUMISAWA MASARU;YOSHIOKA HIRONORI
分类号 H01L21/336;H01L29/06;H01L29/40;H01L29/45;H01L29/78 主分类号 H01L21/336
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