A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid; the heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5); the heat sink (1) comprising a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).
