发明名称 RESIST REMOVING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To remove resist in a substrate without worrying about deformation because of thermal expansion near room temperature. SOLUTION: Unsaturated hydrocarbon gas and ozone gas are supplied to a chamber 2 storing a substrate 10 supplied for removing resist 101 at room temperature under pressure lower than atmospheric pressure. The ozone gas is supplied from an ozone generator 4. The ozone generator 4 liquefies and separates only ozone based on a difference in vapor pressure from gas containing ozone and then vaporizes it again to obtain ultra-high concentration ozone gas. The chamber 2 may have a mixing chamber and a treatment chamber. The mixing chamber and the treatment chamber comprise a partition for dividing the chamber 2 into two chambers, namely upper and lower chambers. The unsaturated hydrocarbon gas and ozone gas are supplied into the mixing chamber. The mixed gas of the unsaturated hydrocarbon gas and ozone in the mixing chamber is transferred to the treatment chamber storing the substrate 10. The partition has a shower head for transferring gas in the mixing chamber into the treatment chamber. In the shower head, a plurality of holes are formed in the partition. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294170(A) 申请公布日期 2008.12.04
申请号 JP20070137290 申请日期 2007.05.23
申请人 MEIDENSHA CORP 发明人 MIURA TOSHINORI
分类号 H01L21/3065 主分类号 H01L21/3065
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