| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently eliminate unevenness of an alumina film with as small a polishing quantity as possible while not increasing the number of processes compared with a conventional CMP process. <P>SOLUTION: A composition for polishing the alumina film to be used in chemical mechanical polishing of an object to be polished including the alumina film having an uneven surface to flatten the uneven surface contains alumina abrasive grains and a protective film forming agent for forming a protective film on the surface of the alumina film and the abrasive grains. The protective film forming agent is water-soluble polymer obtained by polymerizing monomer having one or more OH groups or COOH groups in a molecule and having a weight average molecular weight of 100 or more and 1,000,000 or less. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
