| 摘要 |
FIELD: electricity. ^ SUBSTANCE: components of high-temperature solder are sequentially applied on spiral of refractory metal, then layer of titanium subgroup metal is applied, after that spiral together with support rods is assembled in casing. Assembled unit is heated up to the temperature of titanium subgroup metal solution in solder. On completion of unit soldering and cooling, solder remains are fully removed from spiral surface, mostly by chemical etching. If copper-silver high-temperature solder is used and titanium as active metal, ratio of thicknesses of silver-copper-titanium layers makes 3:1:1 at the thickness of titanium layer of (0.5-2) mcm. Suggested method makes it possible to perform soldered connection of spiral from refractory metal with support dielectric rods, thus providing efficient heat removal from slow-wave structure of miniature traveling-wave tube, which is an urgent objective in creation of powerful diode instruments. ^ EFFECT: maximum heat removal from spiral made of traditionally used refractory material due to reduction of thermal resistance of joined surfaces in case of rigid fixation of spiral in casing. ^ 2 cl, 2 dwg |
