发明名称 HOT MELT RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an elastic resin composition with reduced deterioration after a long time exposure to high temperature, releasable if required, useful as a sealant etc., of a frame of an electronic control unit for an automobile. SOLUTION: The hot melt resin composition 1 is characterized by comprising a styrene based block copolymer, tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyloxyethyl]methane, and tetrakis(2,4-di-t-butyl-5-methylphenyl)-4,4'-biphenylenediphosphonite. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008285612(A) 申请公布日期 2008.11.27
申请号 JP20070133635 申请日期 2007.05.21
申请人 AICA KOGYO CO LTD 发明人 SATO TOMOHIKO
分类号 C08L53/02;C08K5/134;C08K5/5393;C09K3/10 主分类号 C08L53/02
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