发明名称 PATTERN FORMING METHOD, RESIST COMPOSITION TO BE USED IN THE PATTERN FORMING METHOD, NEGATIVE DEVELOPING SOLUTION TO BE USED IN THE PATTERN FORMING METHOD AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT TO BE USED IN THE PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for stably forming a high-accuracy fine pattern to be used in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, a resist composition to be used in the method, a developing solution to be used in the method and a rinsing solution to be used in the method. <P>SOLUTION: The pattern forming method includes: (&alpha;) coating a resist composition including a resin that includes a specific repeating unit, and, by the action of an acid, increases the polarity and decreases the solubility in a negative developing solution; (&beta;) exposing; and (&gamma;) developing with a negative developing solution. There are also provided the resist composition to be used in the method, the developing solution to be used in the method and the rinsing solution to be used in the method. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008281974(A) 申请公布日期 2008.11.20
申请号 JP20070197838 申请日期 2007.07.30
申请人 FUJIFILM CORP 发明人 TSUBAKI HIDEAKI;TARUYA SHINJI;MIZUTANI KAZUYOSHI;WADA KENJI;HOSHINO WATARU
分类号 G03F7/30;C08F20/28;G03F7/038;G03F7/039;G03F7/32;H01L21/027 主分类号 G03F7/30
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