发明名称 Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
摘要 An interconnect assembly including a contact, a first guide film, a space transformer, a second guide film, and an interconnect device including a second contact section having an O-ring-like shape to be inserted into the contact hole by an interference fit, a support section having an engaging protrusion in a predetermined portion and connected to the second contact section in an integrated manner to be inserted into the inside of the first guide opening, a connecting section having an O-ring-like shape of which one side is opened and connected to the support section in an integrated manner thereby being placed between the first guide film and the second guide film, and a first contact section connected to the connecting section in an integrated manner for making contact with the second contact section through the second guide opening.
申请公布号 US7452248(B2) 申请公布日期 2008.11.18
申请号 US20070933735 申请日期 2007.11.01
申请人 SEO DONGWEON;HWANG JUNTAE 发明人 SEO DONGWEON;HWANG JUNTAE
分类号 H01R13/05;H01R13/42;G01R31/28;H01R12/04;H01R12/34;H01R13/24;H01R43/16 主分类号 H01R13/05
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