| 摘要 |
<p>Disclosed is a sheet for forming a protection film which is suitably used in a process wherein a marking is performed on a protection film which is formed on a work such as a wafer. Specifically disclosed is a sheet for forming a protection film for chips, which is composed of a release sheet and a protection film-forming layer arranged on the releasing surface of the release sheet. The protection film-forming layer contains 100 parts by weight of an epoxy resin, 50-200 parts by weight of a binder polymer, and 100-2000 parts by weight of a filler. Not less than 30% by weight of the total, namely 100% by weight of the epoxy resin is selected from the epoxy resins represented by the general formulae (I) and (II) below. (I) (II) In the formulae, X represents-O-,-OCH(CH3)O-or the like, R represents a polyether backbone or the like, and n is a number within the range of 1-10.</p> |
