| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module that has high mechanical strength and can be utilized, even at high temperatures, and to provide a method of manufacturing the thermoelectric conversion module. SOLUTION: The manufacturing method of a thermoelectric conversion module includes an interposing process for interposing an intermediate material unbaked body 32 between p- and n-type semiconductor unbaked bodies 30, 31; a baking process for baking the p- and n-type semiconductor unbaked bodies 30, 31 with the intermediate unbaked body 32 therebetween; and a process for connecting a p-type semiconductor 11, obtained by baking the p-type semiconductor unbaked body 30, to an n-type semiconductor 12 obtained by baking the n-type semiconductor unbaked body 31. COPYRIGHT: (C)2009,JPO&INPIT
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