发明名称 |
Light emitting diode package |
摘要 |
Provided is a light emitting diode package in accordance with the present invention including a lead frame composed of at least a pair of lead terminals; a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold; an LED chip mounted on the lead frame positioned in the mold; an electrode connection unit for electrically connecting the LED chip and the lead frame; and a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip.
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申请公布号 |
US2008277685(A1) |
申请公布日期 |
2008.11.13 |
申请号 |
US20080149008 |
申请日期 |
2008.04.24 |
申请人 |
KIM KYUNG TAE;MIN BONG GIRL |
发明人 |
KIM KYUNG TAE;MIN BONG GIRL |
分类号 |
H01L33/50;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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