A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin.
申请公布号
EP1989735(A2)
申请公布日期
2008.11.12
申请号
EP20070751452
申请日期
2007.02.20
申请人
UNISEM (MAURITIUS) HOLDINGS LIMITED
发明人
RAMOS, MARY JEAN BAJACAN;SAN ANTONIO,ROMARICO SANTOS;SUBAGIO, ANANG