发明名称 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
摘要 |
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.
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申请公布号 |
US7449774(B1) |
申请公布日期 |
2008.11.11 |
申请号 |
US20000677558 |
申请日期 |
2000.09.29 |
申请人 |
FAIRCHILD KOREA SEMICONDUCTOR LTD. |
发明人 |
JEUN GI-YOUNG;JEUN O-SEOB;LEE EUN-HO;LIM SEUNG-WON |
分类号 |
H01L23/29;H01L23/34;H01L23/433;H01L23/495;H01L25/04;H01L25/07;H01L25/18 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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