METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT HAVING A TRENCH STRUCTURE FOR BACKSIDE CONTACT

摘要

The invention relates to a method for producing a micromechanical component. The aim of the invention is to produce at least one trench structure in a substrate, said trench structure having a depth that is less than the substrate thickness. An insulating layer is applied to a first face of the substrate and a filler layer is produced on or applied to the substrate. Said filler layer comprises a filler material that fills the trench structure essentially completely. A planarization within a plane of the filler layer or the insulating layer or the substrate produces a planar first face of the substrate. Subsequently, the second face of the substrate is planarized. The invention also relates to a micromechanical component which is produced according to said method.