发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To manufacture a semiconductor device that enables high-speed operation, has a semiconductor element having a low drive voltage, and ensures low power consumption without going through complicated processes. SOLUTION: A locally thinned region in a semiconductor layer is formed by fusing a peripheral semiconductor layer by heat treatment to allow the fused semiconductor material to flow. An island-shaped semiconductor layer having an opening in the thinned region is formed, the edge of the semiconductor layer around the opening is heated locally by laser beams for fusing, the fused semiconductor material flows in the opening to fill the opening. The opening is filled with the flowing semiconductor material, and a semiconductor layer region having a thin film thickness is realized by solidification. Therefore, the semiconductor layer becomes a continuous semiconductor layer having a thinned region locally. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270664(A) 申请公布日期 2008.11.06
申请号 JP20070114570 申请日期 2007.04.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 MORIWAKA TOMOAKI
分类号 H01L29/786;H01L21/20;H01L21/336;H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L29/786
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