| 摘要 |
A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automatically generating a pick & place machine-specific component loading specification, a pick & place machine-specific component placement sequence and pick & place machine-specific component data for governing the operation of at least one specific pick & place machine in a manufacturing line.
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