| 摘要 |
There is provided a method for manufacturing a wiring board with built-in capacitors in which small high-frequency capacitors, decoupling capacitors, and EMI filter capacitors can be built with precision by using the same method. The method includes preparing an insulating base material 1 having a first metal foil 2 on one side and a second metal foil 3 on the other side; providing an opening in the first metal foil, the opening serving as a metal mask 7 ; using the metal mask to remove the insulating base material exposed in the opening in the metal mask in such a way that a continuous inclined surface is provided from the periphery toward the center of the metal mask; removing the insulating base material, the surface of which is inclined, until the second metal foil is exposed, the removed portion having a diameter smaller than the metal mask; forming a dielectric layer 10 by a printing method in such a way that the dielectric layer covers the second metal foil exposed by removing the insulating base material, the covered area being smaller than the metal mask but larger than the second metal foil exposed by removing the insulating base material; and forming a conductive layer on the dielectric layer and using the conductive layer as a first electrode and the surface of the second metal foil that is in contact with the dielectric layer as a second electrode.
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