发明名称 |
THIN-FILM TEMPERATURE SENSOR, AND OUTGOING LINE CONNECTION METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To improve the connection strength between an electrode for composing a thin-film temperature sensor and a leader line. SOLUTION: The thin-film temperature sensor 1 comprises: an insulating substrate 11; a heat-sensitive film 12 formed on one surface of the insulating substrate 11; a pair of electrode films 13 connected to the heat-sensitive film 12 electrically; a bump 14 formed on the pair of electrode films; and the leader line 15 connected to the bump electrically. The bump 14 is formed by a well known wire bump technique. The size of the bump is made larger than the diameter of the leader line 15. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008241566(A) |
申请公布日期 |
2008.10.09 |
申请号 |
JP20070084613 |
申请日期 |
2007.03.28 |
申请人 |
ISHIZUKA ELECTRONICS CORP |
发明人 |
FUKAGAWA HIROYUKI;TAKADA SHIGERU;TAKIZAWA YASUSHI |
分类号 |
G01K7/22 |
主分类号 |
G01K7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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