发明名称 THIN-FILM TEMPERATURE SENSOR, AND OUTGOING LINE CONNECTION METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To improve the connection strength between an electrode for composing a thin-film temperature sensor and a leader line. SOLUTION: The thin-film temperature sensor 1 comprises: an insulating substrate 11; a heat-sensitive film 12 formed on one surface of the insulating substrate 11; a pair of electrode films 13 connected to the heat-sensitive film 12 electrically; a bump 14 formed on the pair of electrode films; and the leader line 15 connected to the bump electrically. The bump 14 is formed by a well known wire bump technique. The size of the bump is made larger than the diameter of the leader line 15. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008241566(A) 申请公布日期 2008.10.09
申请号 JP20070084613 申请日期 2007.03.28
申请人 ISHIZUKA ELECTRONICS CORP 发明人 FUKAGAWA HIROYUKI;TAKADA SHIGERU;TAKIZAWA YASUSHI
分类号 G01K7/22 主分类号 G01K7/22
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