发明名称 BONDING METHOD OF LAMINATED PIEZOELECTRIC ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent the peeling of an adhesive by suppressing the deterioration of piezoelectric efficiency to a minimum. <P>SOLUTION: When a piezoelectric element fixing part (341-2) is bonded to one end face (341-1a) in the expanding/contracting direction of a laminated piezoelectric element (341-1) in which an internal electrode is laminated comprising an immunity part at the outer periphery, and a vibration friction part (342) is bonded to the other end face (341-1b) in the expanding/contracting direction of the laminated piezoelectric element (341-1), a first annular adhesive reservoir (341-2a) is formed at the piezoelectric element fixing part (341-2). A soft adhesive is held in the first annular adhesive reservoir so that one end face (341-1a) of the laminated piezoelectric element is bonded to the piezoelectric element fixing part (341-2). A second annular adhesive reservoir (342d) and an alignment guide hole (342c) for guiding the position of the other end of the laminated piezoelectric element are formed at the vibration friction part (342). The soft adhesive is held in the second annular adhesive reservoir so that the other end face (341-1b) of the laminated piezoelectric element is bonded to the vibration friction part (342). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243902(A) 申请公布日期 2008.10.09
申请号 JP20070078647 申请日期 2007.03.26
申请人 MITSUMI ELECTRIC CO LTD 发明人 YAMADA TSUKASA;NISHIYAMA TAKAHIKO;TANAKA TOYOKI
分类号 H01L41/083;G02B7/04;H01L41/22;H01L41/27;H01L41/313 主分类号 H01L41/083
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