发明名称 |
TIN PLATING FILM AND METHOD OF PREVENTING WHISKER |
摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of whisker by a simple method capable of easily controlling the formation of a tin plating film formed on an outer lead of a lead frame under a conventional plating condition without deteriorating the productivity. SOLUTION: A tin-silver coating film in which the content of silver is 0.4-3.5 wt.% is formed by forming a tin plating film having 8-20μm thickness on a material to be plated such as the lead frame and depositing silver on the tin plating film and thermally diffusing as a post treatment of the tin plating. The deposition of silver is carried out by a simple method of only dipping into a treating solution. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008240018(A) |
申请公布日期 |
2008.10.09 |
申请号 |
JP20070078518 |
申请日期 |
2007.03.26 |
申请人 |
SUMITOMO METAL MINING CO LTD |
发明人 |
NISHIYAMA YOSHIHIDE |
分类号 |
C25D7/00;C23C10/28;C25D5/50 |
主分类号 |
C25D7/00 |
代理机构 |
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