LIGHT EMITTING DIODE, OPTICAL SEMICONDUCTOR DEVICE, EPOXY RESIN COMPOSITION SUITED FOR OPTICAL SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME

摘要

LIGHT EMITTING DIODE, OPTICAL SEMICONDUCTOR DEVICE, EPOXY RESIN COMPOSITION SUITED FOR OPTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME A light emitting diode is disclosed comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by said LED chip and emits light of a different wavelength, wherein said fluorescent material includes fluorescent particles of small particle size and fluorescent particles of large particle size, said fluorescent particles of large particle size being distributed in the vicinity of said LED chip in said light transmitting resin to form a wavelength converting layer, said fluorescent particles of small particle size being distributed on the outside of said wavelength converting layer in the light transmitting resin.