发明名称 FLEXIBLE PRINTED CIRCUIT AND METHOD FOR FABRICATING THEREOF
摘要 A flexible printed circuit board and a method for fabricating the same are provided to increase the number of channels by connecting pads of a second wiring pattern array to electrode lines through conductive material filled in through holes. A flexible printed circuit board includes a first wiring pattern array(110) and a second wiring pattern array(120). The first wiring pattern array is formed at an upper part of a base film(100) and includes a plurality of wiring patterns. The wiring patterns are separated from each other and include electrode lines(111) and pads(115). The pads are formed at one ends of the electrode lines. The second wiring pattern array includes a plurality of wiring patterns. The wiring patterns are separated from each other and include pads(125) and electrode lines(121). The pads are formed at the upper part of the base film. The electrode lines are formed at a lower part of the base film.
申请公布号 KR20080085443(A) 申请公布日期 2008.09.24
申请号 KR20070026980 申请日期 2007.03.20
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, KI SOO;LIM, HYUN TAE;OH, JONG SOO;KOOK, SEUNG JEONG
分类号 H05K1/02;G02F1/1345 主分类号 H05K1/02
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