| 摘要 |
<P>PROBLEM TO BE SOLVED: To assure the visibility of dot matrix display, and efficiently to improve the reliability and productivity of the LED light-emitting device, and to miniaturize the device. <P>SOLUTION: A cooper thin film 31 is a metal film deposited on both of the front and rear surfaces of a substrate member 111 and the inner wall surface of a through-hole 111c by deposition. A copper paste 32 is a paste with which coating is performed by hot dip coating treatment after that. Here a portion positioned in a through-hole 111c of the copper thin film 31 and the copper paste 32 corresponds to a filling metal member. A portion positioned on a side above the upper surface 111a of the copper thin film 31 and the copper paste 32 corresponds to a metal pad (30a). Portions (31b, 32b) of the copper thin film 31 and the copper paste 32 positioned on a side lower than the rear surface 111b constitute an n-side power supply line 30b. The n-side power supply lines 30b extend in an x direction and are connected to each other on the rear surface 111b of a substrate member 111. <P>COPYRIGHT: (C)2008,JPO&INPIT |
