发明名称 |
Adhesive film for stacking semiconductor chips |
摘要 |
<p>The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film. With such a configuration, the adhesive film for stacking semiconductor chips according to the invention enables the semiconductor silicone chips to be stacked in 3 or more layers without using a separate spacer between chips in order to keep a wire distance between upper and lower chips in stacking the chips. With the configuration, it is advantageous that reliability of semiconductors is not lowered because adhesiveness is kept despite of a repeated process of stacking chips subject to high temperature.</p> |
申请公布号 |
EP1970422(A2) |
申请公布日期 |
2008.09.17 |
申请号 |
EP20070291507 |
申请日期 |
2007.12.12 |
申请人 |
TORAY ADVANCED MATERIALS KOREA INC. |
发明人 |
SIM, CHANG-HOON;JUN, HAE-SANG;MOON, KI-JEONG;LEE, JUN-HO;PARK, YUN-MIN |
分类号 |
C09J7/00;H01L25/065 |
主分类号 |
C09J7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|