| 摘要 |
A method for making a printed circuit from a dielectric film coated with one or more conductive metal layers is disclosed. The method comprises a ste p of marking out the various conductive paths by mechanically machining grooves i n the conductive layer. Machining is carried out using a sharp cutting tool for cutting grooves between the conductive paths without removing any of the conductive material or driving it downwards. For example, a swaging punch or a cutting table controlling a blade may be used to cut grooves. The method is also suitable for making multilayer circuits and is particularly useful for producing flexible printed circuits, connectors, and the like, as well as inductance coils such as those used in smart cards.
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