| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having heat dissipation performance in an AMB, without having to use a thermosoftening thermal conductive sheet and a heat sink for the semiconductor module. SOLUTION: In the semiconductor module 40, the heat sinks 20a and 20b are fitted so as to coat the external surfaces of all semiconductor elements 14 and 16 loaded on a substrate 12 to a module body 10, mixing a plurality of kinds of the semiconductor elements containing at least one of the high heat-generating semiconductor elements 16, having the largest calorific value and a plurality of non-high heat generating semiconductor elements 14 having the calorific value lower than the high heat-generating semiconductor elements 16 and loading the semiconductor elements on the substrate 12. In the semiconductor module 40, the thermal conductive sheets 41 are fitted so as to be interposed among the external surfaces of each non-high heat generating semiconductor element 14 and the heat sinks 20a and 20b, and the external surfaces of the high heat-generating semiconductor elements 16 are fitted so as to be brought directly into contact with the heat sink 20a. COPYRIGHT: (C)2008,JPO&INPIT
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