发明名称 SILICON CARBIDE SEMICONDUCTOR ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve element characteristics by reducing step bunching of a surface of an SiC epitaxial layer formed on an SiC substrate. SOLUTION: A silicon carbide semiconductor element has a 4H-SiC substrate 1 and the SiC epitaxial layer 3 formed on a surface of a 4H-SiC substrate 1, which has an OFF angle of 3°to 5°, at least a partial surface of the SiC epitaxial layer 3 having a surface roughness of≤1 nm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205296(A) 申请公布日期 2008.09.04
申请号 JP20070041162 申请日期 2007.02.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAHASHI KUNIMASA
分类号 H01L29/12;H01L21/28;H01L21/336;H01L29/47;H01L29/78;H01L29/872 主分类号 H01L29/12
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